IEC 63055 Ed. 2.0 en:2023
IEC 63055 Ed. 2.0 en:2023
Format for LSI-Package-Board Interoperable designstandard by International Electrotechnical Commission, 10/01/2023
standard by International Electrotechnical Commission, 10/01/2023
This standard defines a common interoperable format that will be used for the design of a) large-scale integration (LSI), b) packages for such LSI, and c) printed circuit boards on which the packaged LSIs are interconnected. Collectively, such designs are referred to as LSI-Package-Board (LPB) designs. The format provides a common way to specify information/data about the project management, netlists, components, design rules, and geometries used in LPB designs.