Viewed products

Home>BS EN 60749-20:2009

BS EN 60749-20:2009

Standard Number
BS EN 60749-20:2009
Title
Semiconductor devices. Mechanical and climatic test methodsResistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat
Status
Current
Publication Date
31 January 2010
Cross References
IEC 60068-2-20:2008, IEC 60749-3, IEC 60749-35, EN 60068-2-20:2008, EN 60749-3:2002, EN 60749-35:2006
Replaces
BS EN 60749-20:2003

More details

Download

PDF AVAILABLE FORMATS IMMEDIATE DOWNLOAD
$56.00

$140.00

(price reduced by 60 %)

Descriptors
Semiconductor devices, Integrated circuits, Electronic equipment and components, Mechanical testing, Environmental testing, Climate, Plastics, Encapsulated, Surface mounting devices, Thermal testing, Soldering, Solderability testing, Damp-heat tests
Title in French
Dispositifs semiconducteurs. Mthodes dessais mcaniques et climatiques. Rsistance des CMS botiers plastique leffet combin de lhumidit et de la chaleur de brasage
Title in German
Halbleiterbauelemente. Mechanische und klimatische Prfverfahren. Bestndigkeit kunststoffverkappter oberflchenmontierbarer Bauelemente (SMD) gegenber der kombinierten Beanspruchung von Feuchte und Ltwrme
Pages
32
File Size
1.755 MB
Price
140.00

Contact us