BS EN 60191-6-19:2010

Standard Number
BS EN 60191-6-19:2010
Title
Mechanical standardization of semiconductor devicesMeasurement methods of the package warpage at elevated temperature and the maximum permissible warpage
Status
Current
Publication Date
30 June 2010
Cross References
IEC 60191-6-2, IEC 60191-6-5, IEC 60749-20, EN 60191-6-2, EN 60191-6-5, EN 60749-20

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Descriptors
Semiconductor devices, Electronic equipment and components, Standardization, Dimensions, Surface mounting devices, Integrated circuits, Dimensional measurement, Curved, Convex, Concave, Thermal testing, Heating tests, Technical data sheets
Title in French
Normalisation mcanique des dispositifs semiconducteurs. Mthodes de mesure du gauchissement des botiers temprature leve et du gauchissement maximum admissible
Title in German
Mechanische Normung von Halbleiterbauelementen. Messverfahren fr die Gehuse-Verbiegung bei erhhter Temperatur und die maximal zulssige Verbiegung
Pages
18
File Size
1.484 MB
Price
100.00