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IEC 63251 Ed. 1.0 b:2023

IEC 63251 Ed. 1.0 b:2023 Test method for mechanical properties of flexible opto-electric circuit boards under thermal stress

standard by International Electrotechnical Commission, 11/01/2023

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This International Standard defines the thermal endurance test methods for reliability assessment of flexible opto-electric circuit boards. The purpose of this document is to accommodate the uniform thermal characteristics required by the flexible opto-electric circuit in high temperature environments such as automobiles. In particular, this document specifies a test method to inspect the occurrence of colour exchange, deformation and delamination of flexible opto-electric circuit boards under thermal stress.

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Edition: 1.0 Published: 11/01/2023 ISBN(s): 9782832277508 Number of Pages: 46 File Size: 1 file , 4.7 MB Note: This product is unavailable in Ukraine, Russia, Belarus

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